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Product Description
Specifications
Series: VULCAN ZModule Type: 288 Pin Unbuffered DIMM Non ECCCapacity: 8GBx2Frequency: 3200MHzData Transfer Bandwidth: 25,600 MB/s (PC4 25600) Dimensions: 32(H) x 140(L) x 7(W)mmLatency: CL16-18-18-38Tested Voltage: 1.35VHeat Spreader: Aluminum heat spreader
Disclaimers
Memory overclocking (OC) depends on the combination of the memory module and memory controller integrated into the CPU and motherboard.The actual running speed of the memory module differs with different motherboard and CPU and settings.
REINFORCED STRUCTURE
T-FORCE VULCAN Z is designed for complete protection and enhanced heat dissipation. The heat spreader is formed by the punch-press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with an electrolytic anodizing process can enhance corrosion resistance and make it non-conductive.
ENHANCED HEAT DISSIPATION
With superconductivity and thermally conductive adhesive, these memory modules can quickly transfer the heat on IC chip through heat conduction to the aluminum alloy cooling module for better heat dissipation.
STABLE AND DURABLE
Every IC chip made for TEAMGROUP’s T-FORCE VULCAN Z DDR4 gaming memory is selected through a rigorous testing process. All overclocking memory is tested for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, optimal performance, stability and compatibility.
High performance, low power consumption and upgrade easily
In addition to the increase in data transfer rate, the basic working voltage of the new generation of DDR4 memory is also decreased to 1.2V. This desktop memory is energy saving, high performance and low power consumption.
SUPPORTS INTEL & AMD
It is compatible to both Intel & AMD platforms, therefore gamers can build their system without worries.
SUPPORTS XMP2.0
By using the XMP 2.0 technology, users are able to experience the thrill of overclocking easily.
Product Highlight
TEAMGROUP T-Force Vulcan Z DDR4 16GB Kit (2 x 8GB) 3200MHz PC4-25600 CL16 Desktop Memory Ram – Gray
Simple design to perfectly protect the cooling module
High thermal conductive adhesive
Supports Intel & AMD motherboards
Selected high-quality IC
Supports XMP2.0
Energy saving with ultra-low working voltage
More about TEAMGROUP
Official website: www.teamgroupinc.com/en
FB: www.facebook.com/teamgroupinc
IG: www.instagram.com/teamgroupinc
Twitter: twitter.com/teamgroupinc
T-Force
THE POWER FROM TEAMGROUP
T-Force is Team Force, TF.
The RED T represents TEAMGROUP with its decades of accumulated passion and position in storage products, as well as the Black F is the Force of TEAMGROUP’s combined knowledge and over 18 years of research and development in Storage Segment.
T-Force, TF, spread the Wings and Fly is the Logos schematization of TF.
FLY HIGH, FAST and STRONG with T-FORCE spirit
The simple message of the spreading spirit of TF wings, fly high and fast with the force in Team Group gaming products, fly strong with TF’s spirit.
TEAMGROUP – MEMORY OF A LIFETIME
TEAMGROUP products have been well received by the technology media around the globe and have won honors such as Computex D&I Awards, Best Choice Award, Good Design Product Award, Golden Pin design 、TAIWAN EXCELLENCE 、 GOOD DESIGN AWARD 2017、reddot Design Award 2019 and iF Design Award 2018 & 2019. TEAMGROUP also listed company at stock exchange market in January,2019.
Series
VULCAN Z
VULCAN Z
VULCAN Z
VULCAN Z
VULCAN Z
T1
Module Type
288 Pin Unbuffered DIMM Non ECC
288 Pin Unbuffered DIMM Non ECC
288 Pin Unbuffered DIMM Non ECC
288 Pin Unbuffered DIMM Non ECC
288 Pin Unbuffered DIMM Non ECC
288 Pin Unbuffered DIMM Non ECC
Capacity
16GB Kit (8GBx2)
16GB Kit (8GBx2)
32GB Kit (16GBx2)
16GB Kit (8GBx2)
16GB Kit (8GBx2)
16GB Kit (8GBx2)
Frequency
3200MHz
3200MHz
3200MHz
3000MHz
3000MHz
2666MHz
Data Transfer Bandwidth
25,600 MB/s (PC4 25600)
25,600 MB/s (PC4 25600)
25,600 MB/s (PC4 25600)
24,000 MB/s (PC4 24000)
24,000 MB/s (PC4 24000)
21,328 MB/s (PC4 21300)
Latency
CL16-18-18-38
CL16-18-18-38
CL16-18-18-38
CL16-18-18-38
CL16-18-18-38
CL18-18-18-43
Voltage
1.35V
1.35V
1.35V
1.35V
1.35V
1.2V
Dimensions
32(H) x 140(L) x 7(W)mm
32(H) x 140(L) x 7(W)mm
32(H) x 140(L) x 7(W)mm
32(H) x 140(L) x 7(W)mm
32(H) x 134(L)mm
32(H) x 134(L)mm
Heat Spreader
Aluminum heat spreader
Aluminum heat spreader
Aluminum heat spreader
Aluminum heat spreader
Aluminum heat spreader
Special Feature
0.8mm thick heat spreader. High thermal conductive adhesive. Coloring with electrolytic anodizing process.
0.8mm thick heat spreader. High thermal conductive adhesive. Coloring with electrolytic anodizing process.
0.8mm thick heat spreader. High thermal conductive adhesive. Coloring with electrolytic anodizing process.
0.8mm thick heat spreader. High thermal conductive adhesive. Coloring with electrolytic anodizing process.
0.8mm thick heat spreader. High thermal conductive adhesive. Coloring with electrolytic anodizing process.
Exclusive patent. Special ink tested in high temperature environment. Eye-catching visual design.
Simple design to perfectly protect the cooling module
High thermal conductive adhesive
Supports Intel & AMD motherboards
Selected high-quality IC, Supports XMP2.0
Lifetime warranty
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